COB封装对LED光学性能影响的研究

针对LED高光效、低功耗的要求,文章在分析LED光学性能的基础上,采用了COB(ChipOn Board)即板上芯片封装技术。研究了不同封装工艺和材料,分析比较其对LED光通量、光效和色温的影响。研究首先介绍COB封装的结构、优点及其实用性,然后分析影响LED光学性能的因素,最后进行测试。在实验过程中,发现COB封装结构除了具有保护芯片的功能外,还可以提高出光效率,并实现特定的光学分布。实验结果表明:文章提出的封装工艺对于提高光通量和光效、调节色温有良好的效果。

Research of the Effect on the LED Optical Performance from COB Packaging

In this paper,the COB（Chip On Board） packaging technology is adopted in LED products to meet the requirements of high efficiency and low power dissipation.The optical features of LEDs are analyzed first.Subsequently,different packaging technology and materials are introduced to make a comparison between each other＇s effects on the flux,luminous efficiency and color temperature.Finally,the COB packaging technology is presented.After the introduction of its structure,advantages and practical utility,experiments are conducted.The experimental results show that the COB packaging not only has the capability of protecting the LED chips,but improves the efficiency and achieves specific optical distribution.Consequently,the proposed packaging technique achieves an increase on the luminous efficiency and adjusting of color temperature.