电子封装与焊接质量的超声显微检测技术

电子封装内部缺陷的尺度微小,引脚焊接的间距也很小,传统检测方法很难对其进行检测。超声显微技术利用聚焦高频超声来进行检测,能对试样表面、亚表面及其内部一定深度内的细微结构进行显微成像,可用来检测电子封装和评估焊接质量。文章采用高速数据采集卡、高频超声聚焦换能器、宽频脉冲收发仪与高精度运动系统,研发了一套超声显微镜系统。该系统具有较高的精度,功能基本完善,造价相对低廉,能进行全时域波形采集与存储。实验结果表明该系统能检测出电子封装内的微细缺陷,可用来评估引脚的焊接质量。

Scanning Acoustic Microscopy Testing Technology for Electronic Package and Welding Quality

The size of defects in electronic package＇s is micro scale,also the space between welding pins is crowd,so that it difficult to inspect it with traditional testing method.Scanning acoustic microscopy（SAM）with high-frequency focused ultrasound can be used to get deep insight on the micro structure.In this paper,an complete SAM system has been developed including a high-speed data acquisition card,high-frequency ultrasonic focus transducers,a broad band pulse transmitter/receiver,and a high-precision motion system.so this SAM system has some features like high accuracy,high-performance and low cost.Also several advanced non-destructive techniques are accomplished such as full-wave sampling,storing,and dynamical imaging.The inspection results on electronic packages proved that this SAM system can be a useful tool to find electronic package＇s inner micro defects and evaluate the welding quality of the pins.