用于MEMS传感器批量制造的微装配系统

手工操作限制了MEMS传感器的批量生产.为了降低生产成本,同时提高传感器的产品质量,研制了柔性自动阳极键合系统.该系统包括一系列功能模块,包括精密定位系统、显微视觉子系统、柔性微操作手、加热系统、键合夹具、物流系统以及其它的附属系统.通过模块重构和调整,可实现不同尺寸规格传感器的键合.基于显微视觉以及微装配系统的特性,提出了基于小波变换的自动调焦清晰度评价函数,同时提出了基于改进史密斯预估器的用于克服视觉延迟的伺服控制结构.集成一维微力传感器的微操作手可实现高精度和无损操作.为了实现自动化操作,开发了包括任务规划和实时控制功能的控制系统.试验验证了该系统的自动键合功能.

An Microassembly System for Batch Bonding of MEMS Sensors

Batch microassembly of MEMS sensors is limited by the manual manipulation required specially trained technicians. To reduce the production costs and simultaneously obtain high production quality, a flexible microassembly system for automated anodic bonding of MEMS sensors is developed. The system consists of a set of autonomous modules that can adapt their structures and functions to various sizes of MEMS sensors, including positioning stages, a microscopy imaging system, a flexible micromanipulator, a heater, a fixture, a supply station and auxiliary systems. Optomechatronic design is essential to the develo pment of integrated systems due to the basic importance of microscope optics to microassembly. Major methodology issues in optomechatronic design of this system are introduced. A wavelet-based microscopic focus measure and a control scheme with a modified Smith predicator to decrease the inherent time delay of vision system are presented. A smart force sensor with one dimension is employed to sense and control the interactive force. To perform manipulations automatically, a control system, including a task planning level and a real-time execution level, is developed. The productivity of the flexible microassembly system is validated by further experiment.