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Planarization of C-face 4H-SiC substrate using Fe particles and hydrogen peroxide solution
Authors:Akihisa Kubota  Masahiko YoshimuraSakae Fukuyama  Chihiro IwamotoMutsumi Touge
Affiliation:Department of Mechanical System Engineering, Graduate School of Science and Technology, Kumamoto University, 2-39-1 Kurokami, Kumamoto City, Kumamoto 860-8555, Japan
Abstract:
Keywords:Silicon carbide (SiC)  Polishing  Planarization  Atomically flat  Damage-free
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