| 铜线封装工艺技术和可靠性研究 |
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| 引用本文： | 聂纪平.铜线封装工艺技术和可靠性研究[J].中国集成电路,2012(7):65-67,83. |
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| 作者姓名： | 聂纪平 |
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| 作者单位： | 上海贝岭股份有限公司,上海,200233 |
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| 摘 要： | 铜线键合工艺作为当前框架类集成电路封装降低成本的重要措施，但是，铜线带来的相关工艺调整和可靠性认证，以及客户的认证都是当前需要产品公司考虑的问题。本文对于铜线键合工艺和可靠性从多方面进行了研究，对该研究的发展具有借鉴和推广价值。
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| 关 键 词： | 铜线键合 封装可靠性 集成电路封装 |
Cu bonding assembly for process and reliability analyses |
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| NIE Ji-ping.Cu bonding assembly for process and reliability analyses[J].China Integrated Circuit,2012(7):65-67,83. |
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| Authors: | NIE Ji-ping |
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| Affiliation: | NIE Ji-ping (Shanghai Belling Corp., Ltd. Shanghai 200233,China) |
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| Abstract: | Copper bonding processes are the important method to cost down for frame species assembly chip. Bul copper bonding processes should carry out assembly process adjust and quality audit. And customer should accept the new assembly improvement. We research the process and reliability of the copper bonding, and the results could help the research of the field. |
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| Keywords: | Copper bonding assembly quality IC assembly |
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