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| 3D互连中光刻与晶圆级键合技术面临的挑战,趋势及解决方案(英文) | |
| 引用本文： | Margarete Zoberbier,Erwin Hell,Kathy Cook,Marc Hennemayer,Barbara Neubert. 3D互连中光刻与晶圆级键合技术面临的挑战,趋势及解决方案(英文)[J]. 电子工业专用设备, 2010, 39(10): 26-31 |
| 作者姓名： | Margarete Zoberbier Erwin Hell Kathy Cook Marc Hennemayer Barbara Neubert |
| 作者单位： | Margarete Zoberbier,Marc Hennemayer,Dr.-Ing.Barbara Neubert,Margarete Zoberbier,Marc Hennemayer,Dr.-Ing.Barbara Neubert(SUSS Micro Tec Lithography GmbH,85276 Garching,Schleissheimerstr.90,Germany);Erwin Hell,Erwin Hell(SUSS MicroTec Shanghai Co.,Ltd.Room 3703 Nanzheng Building,580 Nanjing Road West,Shanghai 200041,P.R.China);Kathy Cook,Kathy Cook(SUSS MicroTec Inc.,228 Suss Drive,Waterbury Center,VT.05677,USA) |
| 基金项目： | I would like to acknowledge all the co-authors of this paper for their support in creating this paper. |
| 摘 要： | 目前,3D集成技术的优势正在扩展消费类电子产品的潜在应用进入批量市场。这些新技术也在推进着当前许多生产工艺中的一些封装技术包括光刻和晶圆键合成为可能。其中还需要涂胶,作图和蚀刻结构。探讨一些与三维互连相关的光刻技术的挑战。用于三维封装的晶圆键合技术将结合这些挑战和可用的解决方案及发展趋势一并介绍。此外还介绍了一种新的光刻设备,它可通过图形识别技术的辅助实现低于0.25μm的最终对准精度。对于采用光刻和晶圆级键合技术在三维互连中的挑战,趋势和解决方案及SUSS公司设备平台的整体介绍将根据工艺要求来描述。在这些技术中遇到的工艺问题将集中在晶圆键合和光刻工序方面重点讨论。 |
| 关 键 词： | 三维互连 晶圆键合 光刻 解决方案 光刻设备 键合对准精度 发展趋势 |
Challenges,Trends and Solutions for 3D Interconnects in Lithography and Wafer Level Bonding Techniques |
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| Margarete Zoberbier,Erwin Hell,Kathy Cook,Marc Hennemayer,Dr.-Ing.Barbara Neubert. Challenges,Trends and Solutions for 3D Interconnects in Lithography and Wafer Level Bonding Techniques[J]. Equipment for Electronic Products Marufacturing, 2010, 39(10): 26-31 | |
| Authors: | Margarete Zoberbier Erwin Hell Kathy Cook Marc Hennemayer Dr.-Ing.Barbara Neubert |
| Affiliation: | 1. SUSS Micro Tec Lithography GmbH,85276 Garching,Schleissheimerstr.90,Germany 2. SUSS MicroTec Shanghai Co.,Ltd.Room 3703 Nanzheng Building,580 Nanjing Road West,Shanghai 200041,P.R.China 3. SUSS MicroTec Inc.,228 Suss Drive,Waterbury Center,VT.05677,USA |
| Abstract: | Technology advances such as 3D Integration are expanding the potential applications of products into mass markets such as consumer electronics.These new technologies are also pushing the envelope of what's currently possible for many production processes,including lithography processes and wafer bonding.There is still the need to coat,pattern and etch structures.This paper will explore some of the lithographic challenges associated with 3D interconnection technology.Wafer bonding techniques as used in the 3... |
| Keywords: | 3D Integration Wafer Bonding Lithography Solutions Maskalinger Bonding Alignment Accuracy Trends |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ | |