电沉积制备铜钴颗粒膜

采用电沉积方法制备了铜钴巨磁电阻功能膜，研究了电沉积工艺参数，包括镀液的主盐离子浓度、配合剂浓度、pH值以及沉积时的电流密度等对铜钴颗粒膜层的组成的影响．用扫描电镜、金相显微镜、EDX能谱仪和XRD分析了镀层组成、表面形貌和结构．膜层的组成成分、晶粒大小与镀液的主盐离子浓度、配合剂浓度、pH值以及沉积时的电流密度有着直接的联系．镀液中钴离子浓度增大时，镀层中的钴含量相应的提高，镀层结晶更加粗大．镀层中铜离子浓度增大时，镀层中的铜含量提高，镀层结晶变得致密．配合剂柠檬酸钠浓度增加对镀层中钴的含量起到一定的抑止作用，而对铜的沉积则有促进作用，同时颗粒膜层结晶更加致密．低pH值下有利于铜的沉积，但此时镀层的晶粒较为粗大．控制电流密度可以改变镀层的组成，较高的电流密度有利于钴的沉积．

Preparation of Cu- Co granular film by electrodeposition

Cu- Co film as giant magnetoresistance was prepared by electrodeposition. The composition of the electrodeposited Cu - Co film was affected by the eletrodeposition parameters, such as the concentrations of the main salts and complexing reagent, the pH value, and the electric current density. Scaning electron microscope, metallography microscope, Energy Dispersive X - ray and XRD were used to examine the composition, surface moghology and structure of the plating films. The composition and particle size of the Cu - Co film were directly related with the concentration of the main salts and complexing reagent, pH value and electric current density. With increasing the cobahion concentration in the bath, the content of cobalt increased correspondingly in the film, and the grains were much bigger. The content of copper in the film increased and the film was much more compact while the copperion concentration increased in the bath. Inceaseing the concentration of complexing reagent sodium citrate in the bath will suppress the deposition of cobalt, but will promote the deposition of copper and the compaction of the film. Low pH value was favourable for the deposition of copper, but it made the grains bigger. The composition of the film can be controlled by changing the current density. Higher current density can promote the deposition of cobalt.