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复合化学镀(Ni—Cu—P)—Al2O3的工艺研究
引用本文:吴玉程,黄新民.复合化学镀(Ni—Cu—P)—Al2O3的工艺研究[J].电镀与精饰,1998,20(6):1-4.
作者姓名:吴玉程  黄新民
作者单位:合肥工业大学材料科学与工程系
基金项目:安徽省自然科学基金,中青年学科带头人培养基金
摘    要:研究了复合化学镀(Ni-Cu-P)-Al2O3的工艺与组成,复合材料的沉积速率高于Ni-Cu-P合金;随着镀液中Al2O3添加量的增加,复合镀层中Al2O3体积分数提高,达到25g/L时则不再上升,氧化铝与Ni-Cu-P合金复合,致使(Ni-Cu-P)-Al2O3的组成由非晶态过渡到晶态,随着热处理温度的升高发生不同的变化。

关 键 词:复合化学镀  化学镀  电镀  工艺  镀合金  氧化铝

Research of Technology and Composition of Electroless Composite Plating (Ni Cu P) Al 2O 3
Wu Yucheng,Huang Xinmin,Wang Zheng,Zhang Wangda,Deng Zonggang.Research of Technology and Composition of Electroless Composite Plating (Ni Cu P) Al 2O 3[J].Plating & Finishing,1998,20(6):1-4.
Authors:Wu Yucheng  Huang Xinmin  Wang Zheng  Zhang Wangda  Deng Zonggang
Affiliation:Department of Materials Science & Engineering
Abstract:The technology and composition of electroless composite plating (Ni Cu P) Al 2O 3 were studied. The results show that the deposition rate of composites were higher than that of Ni Cu P,Al 2O 3 fraction of the composites was increased with the addition of the particle in the solution until attaining 25 g/L, co deposition of alumina and Ni Cu P substrate makes the microstructure transforms from amorphous to crystalline state, which changes with heat treatment.
Keywords:electroless composite plating  Ni  Cu  P  Al  2O  3
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