| 混成焦平面器件倒装互连设备对准精度分析 |
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| 引用本文： | 孙娟 李建林. 混成焦平面器件倒装互连设备对准精度分析[J]. 红外技术, 1997, 19(5): 30-32 |
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| 作者姓名： | 孙娟 李建林 |
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| 作者单位： | 昆明物理研究所!昆明，650223 |
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| 摘 要： | 讨论了混成焦平面倒装互连常用的重叠影象对准方式的对准精度。认为重叠影象对准方式的对准精度受对准系统物镜的对准精度、光学转换精度等的限制。
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| 关 键 词： | 混成焦平面器件 倒装互连设备 对准精度 |
Alignment Accurcy Analysis of The Flip Chip Bonder for Hybrid FPA |
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| Sun Juan, Li Jianlin. Alignment Accurcy Analysis of The Flip Chip Bonder for Hybrid FPA[J]. Infrared Technology, 1997, 19(5): 30-32 |
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| Authors: | Sun Juan Li Jianlin |
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| Abstract: | Accuracy of Superimposed images method for the alignment of hybrid FPA technologies isdiscussed. The align ment accuracy is Supposed to be limited by accuracy of an objective alignmentand conversion. |
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| Keywords: | Hybrid FPA Flip chip Align accuracy |
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