Effect of solder filler thickness on the mechanical stability of fiber-solder-ferrule joint under temperature cyclic loading |
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Authors: | C W Tan Y C Chan N H Yeung |
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Affiliation: | (1) Department of Electronic Engineering, City University of Hong Kong, 83 Tat Chee Avenue, Kowloon, Hong Kong |
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Abstract: | The base materials of package and ferrule are often gold-coated Kovar and Invar, they both have relatively low coefficient
of thermal expansion (CTE). Solder 63Sn37Pb dissolves Au substantially and forms brittle AuSn4, which may cause catastrophic failure in the fiber-solder-ferrule (FSF) joint in the long-term application. It is well known
that thermal fatigue creep is one of the crucial factors affecting the life and reliability of a solder joint in electronic
and optoelectronic assemblies. Therefore, it is important to understand the behavior of the FSF joint under thermal cyclic
loading. In this study, four different thicknesses of solder filler in a FSF joint were examined. By using the finite element
method (FEM), the equivalent creep strains of eutectic lead-tin solder were compared. The joints were subjected to 5 cycles
of temperature cycling test, i.e., −65 to 150∘C. It was found that the thicker solder filler is subjected to a larger equivalent creep strain than the thinner solder filler.
It is discussed the vertical shift of the optical fiber, which is sensitive to temperature and has effects on the power loss
coupling. Modeling and experimental results show that 0.5 mm is the best inner diameter of ferrule that provides the lowest
displacement and, thus, the lowest power loss under temperature cycle. |
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