半物理仿真系统现状及发展趋势 |
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引用本文: | 吴双. 半物理仿真系统现状及发展趋势[J]. 工业仪表与自动化装置, 2016, 0(2): 16-20. DOI: 10.3969/j.issn.1000-0682.2016.02.004 |
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作者姓名: | 吴双 |
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作者单位: | 上海飞机设计研究院 民用飞机模拟飞行重点实验室,上海,201210 |
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摘 要: | 半物理仿真以其高效率、低成本等优势,已成为当前复杂系统的一种重要研究方法。针对半物理仿真技术如何更好的适用于未来复杂系统研究,该文简要阐述了半物理仿真系统的基本概念和系统组成,列举并分析了当前已有半物理仿真系统产品及其特点;通过分析CPS等未来复杂系统特点及多领域建模技术发展方向,提出了半物理仿真系统的发展趋势;从半物理仿真系统构成及实现角度出发,提出了研发未来半物理仿真系统亟待解决的关键技术。
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关 键 词: | 复杂系统 多领域建模 半物理仿真 硬件接口 代码生成 |
Application status and development trend of hardware-in-the-loop simulation system |
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Abstract: | With the advantages of high efficiency and low-cost, the hardware-in-the-loop simulation ( HILS) has become the most important research method. To solve the problem of the future complex sys-tem HILS, current situation and trend of the HILS are analyzed. The basic notion and composition of HILS system are introduced in the paper. And the current HILS systems are listed and analyzed. By ana-lyzing the CPS and the multi-domain modeling technology, the trends of HILS system are presented. From the implementation of HILS system, the unsolved key technologies are highlighted, such as code generation and hardware interface. |
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Keywords: | complex system multi-domain modeling hardware-in-the-loop simulation hardware interface code generation |
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