LED照明散热研究进展

LED由于具有工作电压低、耗电量小、发光效率高、结构牢固、重量轻、体积小、成本低等众多优点,必将成为未来一般照明市场的主要光源。但散热问题一直是阻扰LED发展的瓶颈。本文从内部封装散热和外部散热方式两个方面介绍了LED的散热状况。低热阻、散热良好的封装结构是LED散热的关键,性能优良的封装材料则可以很好改善LED的散热性能。在增强封装散热的同时,努力提高外部散热方式可以提高散热效率。

New Development of Research on Heat Dissipation of LEDs Lighting

With many advantages,such as low load voltage,small power consumption,high luminous efficiency,solid structure,light weight,small volume and low cost,LED became the major light source of general lighting market in the future.However,LED heat management problem was the bottleneck for the LED development.The thermal conditions of LED from the package structure and external cooling methods were presented.Low thermal resistance and good heat dissipation LED package structure was the key technology of LED heat dissipation.Packaging materials with excellent properties was very imperotant to improve the cooling performance.The enhanced cooling package can improve the cooling efficiency of the external cooling methods.