| SnAgCuEr系稀土无铅钎料的显微组织与性能研究 |
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| 引用本文： | 田君,郝虎,史耀武,雷永平,夏志东. SnAgCuEr系稀土无铅钎料的显微组织与性能研究[J]. 材料科学与工艺, 2008, 16(2): 281-283 |
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| 作者姓名： | 田君 郝虎 史耀武 雷永平 夏志东 |
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| 作者单位： | 北京工业大学,材料科学与工程学院,北京,100022 |
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| 基金项目： | 国家高技术研究发展计划(863计划) |
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| 摘 要： | 系统研究了添加微量稀土Er对Sn3.8Ag0.7Cu钎料合金显微组织和性能的影响,通过对钎料的熔化温度、润湿性能、接头剪切强度的测试及显微组织观察,指出含微量稀土的SnAgCuEr合金是性能优良的无铅钎料合金,同时确定了最佳的Er含量范围.
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| 关 键 词： | 无铅钎料 SnAgCu合金 稀土Er |
| 文章编号： | 1005-0299(2008)02-0281-03 |
| 修稿时间： | 2005-04-12 |
Microstructure and performance of SnAgCuEr lead-free solders with rare earth |
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| TIAN Jun,HAO Hu,SHI Yao-wu,LEI Yong-ping,XIA Zhi-dong. Microstructure and performance of SnAgCuEr lead-free solders with rare earth[J]. Materials Science and Technology, 2008, 16(2): 281-283 |
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| Authors: | TIAN Jun HAO Hu SHI Yao-wu LEI Yong-ping XIA Zhi-dong |
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| Affiliation: | (School of Materials Science and Engineering, Beijing University of Technology,Beijing 100022, China) |
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| Abstract: | The effect of minimal amount of rare earth Er on the microstructure and performance of Sn3.8Ag0.7Cu solder alloy.has been systematically investigated. Through measuring the melting temperature, wettability and joint shear strength, and observing the microstructure, it is indicated that the SnAgCuEr alloy containing rare earth is a lead-free solder with an excellent performance. At the same time the best content of Er is determined. |
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| Keywords: | lead-free solder SnAgCu alloy rare earth Er |
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