Analysis of three-dimensional interface cracks using enriched finite elements |
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Authors: | A O Ayhan A C Kaya H F Nied |
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Affiliation: | (1) Global Research Center, General Electric Company, Niskayuna, NY 12309, USA;(2) Mechanical Engineering and Mechanics, Lehigh University, Bethlehem, PA 18015-3085, USA |
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Abstract: | Many important interface crack problems are inherently three-dimensional in nature, e.g., debonding of laminated structures
at corners and holes. In an effort to accurately analyze three-dimensional interface fracture problems, an efficient computational
technique was developed that utilizes enriched crack tip elements containing the correct interface crack tip asymptotic behavior.
In the enriched element formulation, the stress intensity factors K
I, K
II, and K
III are treated as additional degrees of freedom and are obtained directly during the finite element solution phase. In this
study, the results that should be of greatest interest are obtained for semi-circular surface and quarter-circular corner
cracks. Solutions are generated for uniform remote tension and uniform thermal loading, over a wide range of bimaterial combinations.
Of particular interest are the free surface effects, and the influence of Dundurs’ material parameters on the strain energy
release rate magnitudes and corresponding phase angles. |
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Keywords: | Interface cracks Three-dimensional cracks Finite elements Surface cracks Corner cracks Enriched elements Dundurs’ parameters Phase angle Stress intensity factors Silicon Epoxy |
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