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Analysis of three-dimensional interface cracks using enriched finite elements
Authors:A O Ayhan  A C Kaya  H F Nied
Affiliation:(1) Global Research Center, General Electric Company, Niskayuna, NY 12309, USA;(2) Mechanical Engineering and Mechanics, Lehigh University, Bethlehem, PA 18015-3085, USA
Abstract:Many important interface crack problems are inherently three-dimensional in nature, e.g., debonding of laminated structures at corners and holes. In an effort to accurately analyze three-dimensional interface fracture problems, an efficient computational technique was developed that utilizes enriched crack tip elements containing the correct interface crack tip asymptotic behavior. In the enriched element formulation, the stress intensity factors K I, K II, and K III are treated as additional degrees of freedom and are obtained directly during the finite element solution phase. In this study, the results that should be of greatest interest are obtained for semi-circular surface and quarter-circular corner cracks. Solutions are generated for uniform remote tension and uniform thermal loading, over a wide range of bimaterial combinations. Of particular interest are the free surface effects, and the influence of Dundurs’ material parameters on the strain energy release rate magnitudes and corresponding phase angles.
Keywords:Interface cracks  Three-dimensional cracks  Finite elements  Surface cracks  Corner cracks  Enriched elements  Dundurs’  parameters  Phase angle  Stress intensity factors  Silicon  Epoxy
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