Fracture behavior of Cu-cored solder joints |
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Authors: | Yunsung Kim Hyelim Choi Hyoungjoo Lee Dongjun Shin Jeongtak Moon Heeman Choe |
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Affiliation: | (1) School of Advanced Materials Engineering, Kookmin University, Jeongneung-dong, Seongbuk-gu, Seoul, 136-702, Republic of Korea;(2) MK Electron Co., Ltd, 316-2 Geumeoh-ri, Pogok-eup, Cheoin-gu, Yongin-si, Kyeonggi-do, 449-812, Republic of Korea; |
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Abstract: | Copper-cored solder can be regarded as the next-generation solder for microelectronic semiconductors exposed to harsh operating
conditions owing to its excellent sustainability under extreme thermal conditions, e.g., in microelectronic semiconductors
used in transportation systems. Cu-cored solder joints with two different coating layers, Sn–3.0Ag and Sn–1.0In, were compared
with the baseline Sn–3.0Ag–0.5Cu solder. The fracture strength and failure mode were examined using the high-speed ball-pull
and normal-speed shear tests. The Cu-cored solder joint with the Sn–1.0In plating layer exhibited the highest ball-pull and
shear strengths. In addition, it showed a much lower percentage of interface fracture between the Cu-core and plating layer
than the interface fracture percentage in the Sn–3.0Ag plating layer due to the improved wettability between the Cu-core and
Sn–1.0In plating layer. |
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