| 一种超粗化表面处理用于改善沉锡脱油的工艺探讨 |
| |
| 引用本文： | 谢军,陈春.一种超粗化表面处理用于改善沉锡脱油的工艺探讨[J].印制电路信息,2012(4):52-54. |
| |
| 作者姓名： | 谢军 陈春 |
| |
| 作者单位： | 深圳市金百泽电子科技股份有限公司,广东深圳,518057 |
| |
| 摘 要： | 沉锡工艺是一种代替传统热风整平的新型环保工艺,但沉锡工艺中的脱油问题一直是难以解决的问题,现通常方法是使用专用耐沉锡油墨或前处理使用超粗化药水处理板面,提高油墨和铜面的结合力,前两种方法的生产成本大大升高;本文根据现有的前处理方式,实验出适合沉锡使用的阻焊前处理方式,并列举该方式的具体应用。
|
| 关 键 词： | 超粗化 前处理 沉锡 脱油 |
A super fine surface treatment improve solder mask peeling off for immersion tin PCB |
| |
| XIE Jun,CHEN Chun.A super fine surface treatment improve solder mask peeling off for immersion tin PCB[J].Printed Circuit Information,2012(4):52-54. |
| |
| Authors: | XIE Jun CHEN Chun |
| |
| Affiliation: | XIE Jun CHEN Chun |
| |
| Abstract: | Immersion tin is a new environmental process instead of conversional HALS process.However,Solder mask peeling off issue happened in many PCB factory when they use this process.Normally,PCB factory used special ink or special super-fine chemical pretreatment to settle this issue.But these methods cause the cost up.Based on the pretreatment which are available in our factory now,this paper found the proper pretreatment methods to settle solder mask peeling off issue by increase the bonding force between the copper and ink. |
| |
| Keywords: | Super fine roughness pretreatment immersion Tin solder mask peeling off |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
|
