Characterization and Adhesion in Cu/Ru/SiO2/Si Multilayer Nano-scale Structure for Cu Metallization |
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| Authors: | N. Chawla S. H. Venkatesh D. R. P. Singh T. L. Alford |
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| Affiliation: | 1. Materials Science and Engineering, School for Engineering of Matter, Transport, and Energy, Arizona State University, Tempe, AZ, 85287-6106, USA
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| Abstract: | In this study, we have characterized the microstructure, resistivity, and dynamic deformation behavior of Cu/Ru/SiO2 and Cu/SiO2 samples under scratch loading conditions. Cu/Ru/SiO2 samples showed higher elastic recovery and hardness when compared to the Cu/SiO2 samples. In the case of Cu/Ru/SiO2 samples, Ru acts as a glue layer between the Cu and the SiO2 substrate providing both strength and toughness against dynamic loading. Hence, the critical load for delamination is higher for Cu/Ru/SiO2 samples compared to Cu/SiO2 samples. Our results show that Cu/Ru/SiO2 thin films present significant potential to be used in Cu metallization. |
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