| 薄膜复合结构界面端热应力分布研究 |
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| 引用本文： | 李慧,张军.薄膜复合结构界面端热应力分布研究[J].山西建筑,2011,37(11):34-35. |
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| 作者姓名： | 李慧 张军 |
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| 作者单位： | 1. 黄河科技学院,河南,郑州,450063
2. 郑州大学,河南,郑州,450000 |
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| 摘 要： | 以类金刚石（DLC）薄膜／基体建立理论计算模型，以粘结界面端点为顶点，采用Airy函数，建立应力随r变化的函数关系，得到界面表面的应力表达式，从而计算出膜／基结合体系在热应力下的应力分布，并采用有限元软件ABAQUS对计算结果进行了验证，证实了理论模型的可行性。
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| 关 键 词： | 膜／基复合结构 界面结合强度 界面损伤和破坏 |
Analyses of interfacial thermal stresses for film/substrate structure |
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| LI Hui,ZHANG Jun.Analyses of interfacial thermal stresses for film/substrate structure[J].Shanxi Architecture,2011,37(11):34-35. |
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| Authors: | LI Hui ZHANG Jun |
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| Affiliation: | LI Hui ZHANG Jun |
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| Abstract: | In this paper, a relationship of stress as a factor of r is established using Airy functions based on the establishment of theoretical models with Diamond-Like Carbon （DLC） film/substrate system with bonding interface endpoint as the vertex, according to strain relation, thus cal- culate stress distribution in the film/substrate system under thermal loading, and use the finite element software ABAQUS to verify the feasibility of the theoretical model. |
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| Keywords: | film/composite structure interfacial bonding intensity interface damage |
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