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Bonding Interface Formation between Mg Alloy and Steel by Liquid-phase Bonding using the Ag Interlayer
Authors:Masaki Koba  Toshio Araki  Shoichi Nambu  Junya Inoue and Toshihiko Koseki
Affiliation:(1) Department of Materials Engineering, The University of Tokyo, Tokyo 113-8656, Japan
Abstract:Liquid-phase bonding between a Mg alloy (AZ31) and low-carbon steel was attempted at 773 K (500 °C) using Ag as an interlayer that forms a eutectic melt with the Mg alloy at this temperature. On the AZ31 side, eutectic melting and subsequent isothermal solidification were observed, and it was confirmed that the solidification of the eutectic liquid was promoted by the diffusion of Ag into the AZ31 base metal. On the steel side, Al was transported from AZ31 during the eutectic melting and isothermal solidification. This transported Al was enriched at the steel surface and reacted with steel to form a uniform, thin Fe-Al intermetallic compound layer. After the isothermal solidification, strong bonding was achieved via the thin intermetallic compound layer between AZ31 and steel, and no Ag remained at the bonding interface. The strength of the joint was found to be higher than the yield strength of AZ31.
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