| 高压真空断路器用熔渗法CuMoCr触头材料的制备工艺 |
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| 引用本文： | 陈光明,兰岚,陈名勇. 高压真空断路器用熔渗法CuMoCr触头材料的制备工艺[J]. 电工材料, 2006, 0(3): 6-8 |
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| 作者姓名： | 陈光明 兰岚 陈名勇 |
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| 作者单位： | 桂林金格电工电子材料科技有限公司,广西桂林,541004 |
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| 摘 要： | 介绍了高压真空断路器用熔渗法CuMoCr触头材料的制备工艺。研究了原材料预处理温度对Cu粉、Mo粉含氧量的影响,以及Cu粉与MoCr粉的混合比例对熔渗后坯件体积变化的影响,并对结果进行了分析。
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| 关 键 词： | CuMoCr触头 熔渗 氧含量 |
| 文章编号： | 1671-8887(2006)03-0006-03 |
| 收稿时间： | 2006-07-10 |
| 修稿时间： | 2006-07-10 |
Manufacture of Infiltrated CuMoCr Contact Material for High-voltage Vacuum Circuit Breakers |
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| CHEN Guang-ming,LAN Lan,CHEN Ming-yong. Manufacture of Infiltrated CuMoCr Contact Material for High-voltage Vacuum Circuit Breakers[J]. Electrical Engineering Materials, 2006, 0(3): 6-8 |
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| Authors: | CHEN Guang-ming LAN Lan CHEN Ming-yong |
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| Abstract: | The manufacturing process of CuMoCr contact material used for high-voltage vacuum circuit breakers is introduced.The effect of the raw material pretreatment temperatures on the oxygen contents of copper powder and molybdenum powder,and the effect of the proportions of copper and molybdenum chromium in the CuMoCr mixture powder on the blank volume change after infiltration were studied. The experimental results are theoretically analyzed. |
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| Keywords: | CuMoCr contact infiltration oxygen content |
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