| 低热膨胀聚(苯并噁唑-酰亚胺)薄膜与铜黏结性能EI北大核心CSCD |
| |
| 引用本文： | 崔超,袁莉莉,尹亮,黄玉东,孟令辉,杨念群,杨士勇. 低热膨胀聚(苯并噁唑-酰亚胺)薄膜与铜黏结性能EI北大核心CSCD[J]. 材料工程, 2022, 50(10): 128-138. DOI: 10.11868/j.issn.1001-4381.2021.001095 |
| |
| 作者姓名： | 崔超 袁莉莉 尹亮 黄玉东 孟令辉 杨念群 杨士勇 |
| |
| 作者单位： | 1.哈尔滨工业大学 化工与化学学院, 哈尔滨 1500062 中国运载火箭技术研究院, 北京 1000763 中国科学院 化学研究所, 北京 1001904 武汉光谷创元电子有限公司, 武汉 430073 |
| |
| 摘 要： | 采用氧等离子体活化聚(苯并噁唑-酰亚胺)(PI)薄膜,以此为基底,通过离子注入和化学电镀铜工艺制备高黏结性、耐锡焊性的无胶柔性单面覆铜板(FCCL)。控制气流压强,研究处理功率、处理时间对薄膜表面结构、化学成分及其与Cu层黏结性能的影响。结果表明:氧等离子体改性对改善PI薄膜黏结性能有重要影响,控制压强30 Pa,处理功率100 W,时间10 min,表面引入含氧极性基团,蚀刻明显,使薄膜的浸润性增强;PI薄膜与铜离子形成络合物,进一步赋予FCCL优良的黏结性能,其剥离强度比现有FCCL提高60%以上。
|
| 关 键 词： | 苯并噁唑 聚酰亚胺 离子注入 柔性覆铜板 剥离强度 |
| 收稿时间： | 2021-11-10 |
Adhesion property between low-thermal-expansion poly(benzoxazole-imide) film and ion-implanted copper |
| |
| Chao CUI,Lili YUAN,Liang YIN,Yudong HUANG,Linghui MENG,Nianqun YANG,Shiyong YANG. Adhesion property between low-thermal-expansion poly(benzoxazole-imide) film and ion-implanted copper[J]. Journal of Materials Engineering, 2022, 50(10): 128-138. DOI: 10.11868/j.issn.1001-4381.2021.001095 |
| |
| Authors: | Chao CUI Lili YUAN Liang YIN Yudong HUANG Linghui MENG Nianqun YANG Shiyong YANG |
| |
| Affiliation: | 1.School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin 150006, China2 China Academy of Launch Vehicle Technology, Beijing 100076, China3 Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China4 Wuhan Optical Valley Chuangyuan Electronics Co., Ltd., Wuhan 430073, China |
| |
| Abstract: | Surface modification of poly(benzoxazole-imide) (PI) film was carried out by means of oxygen plasma treatment. A flexible copper clad laminate (FCCL) was fabricated using Ni-Cr ion implantation and electro-Cu plating process. Controlling the constant pressure, the effects of such treatment conditions as power and time were systematically investigated on the surface roughness, chemical composition and interface adhesion with Cu. It is found that the optical parameters for production of FCCL with excellent adhesion and solder resistance are 50 W/5 min and 100 W/10 min, respectively. Suitable roughness, reactive radical with high content pendent oxygen group, and metal-oxazole complex help to endow exceptional adhesive property to the interface of PI/Cu. And the peel strength of FCCL prepared from PI film with such modified surface rises by 60%. |
| |
| Keywords: | benzoxazole polyimide ion implantation flexible cupper clad laminate peel strength |
| 本文献已被 维普 等数据库收录！ |
| 点击此处可从《材料工程》浏览原始摘要信息 |
|
点击此处可从《材料工程》下载全文 |
|
