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RA-ECDM of Silicon Wafers Using Taguchi’s Methodology and Machine Learning Algorithms |
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| Authors: | Singh Manpreet Antil Parvesh Singh Sarbjit Katal Nitish Bakshi Dapinder Kaur Alkesh |
| Affiliation: | 1.Punjab State Council for Science & Technology, Chandigarh, India ;2.Department of Basic Engineering, College of Agricultural Engineering & Technology, CCS HAU, Hisar, Haryana, India ;3.Department of Mechanical Engineering, Punjab Engineering College, Chandigarh, India ;4.School of Electronics, Indian Institute of Information Technology, Una, Himachal Pradesh, India ; |
| Abstract: | Silicon - As a prominent machining process, electrochemical discharge machining (ECDM) is used to process materials that are both fragile and difficult to cut. The growing use of this method for... |
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