| 硅微陀螺仪器件级真空封装 |
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| 引用本文： | 施芹,丁荣峥,苏岩,裘安萍.硅微陀螺仪器件级真空封装[J].机械工程学报,2009,45(2). |
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| 作者姓名： | 施芹 丁荣峥 苏岩 裘安萍 |
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| 作者单位： | 1. 南京理工大学智能弹药技术国防重点学科实验室,南京,210094
2. 无锡中微高科电子有限公司,无锡,214035 |
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| 基金项目： | 国家自然科学基金，江苏省自然科学基金，江苏省青蓝工程支持计划 |
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| 摘 要： | 为实现硅微陀螺仪真空封装以提高其性能,对硅微陀螺仪器件级真空封装技术进行研究.首先,设计硅微陀螺仪的专用陶瓷封装管壳,并采用钎焊技术进行封帽,采用金锑合金为焊料以满足封装过程中的高温.分析除气工艺对硅微陀螺仪品质因数的影响,除气试验结果表明,将硅微陀螺仪芯片和封装壳体放置在真空炉中进行高温烘烤,能有效地提高硅微陀螺仪的品质因数.制定硅微陀螺仪器件级真空封装的工艺流程,封装好的硅微陀螺仪的品质因数约为10 363.7,约为空气下的50倍.硅微陀螺仪品质因数跟踪测试结果表明,真空封装的硅微陀螺仪存储5个月后,其品质因数降低为最初的55.1%,这表明采用该器件级真空封装技术封装的硅微陀螺仪的真空保持度较差,有待进一步研究.
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| 关 键 词： | 硅微陀螺仪 器件级真空封装 品质因数 除气工艺 |
Device-level Vacuum Packaging of Silicon Microgyroscopes |
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| SHI Qin,DING Rongzheng,SU Yan,QIU Anping.Device-level Vacuum Packaging of Silicon Microgyroscopes[J].Chinese Journal of Mechanical Engineering,2009,45(2). |
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| Authors: | SHI Qin DING Rongzheng SU Yan QIU Anping |
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| Affiliation: | 1.Ministerial Key Laboratory of ZNDY;Nanjing University of Science and Technology;Nanjing 210094;2.Wuxi Zhongwei High Technology Electronics Co.;Ltd.;Wuxi 214035 |
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| Abstract: | The device-level vacuum packaging technologies of silicon microgyroscopes are studied in order to carry out vacuum packaging of silicon microgyroscopes to improve performance of microgyroscopes.First,the special ceramic packages for silicon microgyroscopes are designed and the soldering sealing technology is adopted.The alloy An/St is adopted to cater for the high temperature in the packaging process.The effects of degassing process on the quality factor of silicon microgyroscopes are studied,and the result... |
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| Keywords: | Silicon microgyroscopes Device-level vacuum packaging Quality factor Degassing process |
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