| CS-38新型印制电路板铜基上化学镀银工艺 |
| |
| 引用本文： | 李孝琼,周海平,张正,王克军.CS-38新型印制电路板铜基上化学镀银工艺[J].印制电路信息,2008(7):34-35,47. |
| |
| 作者姓名： | 李孝琼 周海平 张正 王克军 |
| |
| 作者单位： | 中南电子化学材料所,湖北,武汉,430070 |
| |
| 摘 要： | 介绍了一种在印制电路板铜基上化学镀银的新工艺CS-38，它是一种既可焊接又能键合（Bonding）并能有效取代热风整平（HASL）的新工艺。讨论了各组分及操作条件对镀银液及镀银层的影响，确定了最佳配方和操作工艺。结果表明：该工艺镀银液稳定．防变色能力强，特适合规模化生产。
|
| 关 键 词： | 化学镀银 印制电路板 |
CS-38,A New Immersion Silver Plating Process Over Copper for PCB |
| |
| LI Xiao-qiong,ZHOU Hai-ping,ZHANG Zheng,WANG Ke-jun.CS-38,A New Immersion Silver Plating Process Over Copper for PCB[J].Printed Circuit Information,2008(7):34-35,47. |
| |
| Authors: | LI Xiao-qiong ZHOU Hai-ping ZHANG Zheng WANG Ke-jun |
| |
| Affiliation: | LI Xiao-qiong ZHOU Hai-ping ZHANG Zheng WANG Ke-jun |
| |
| Abstract: | The paper introduces a new electroless Ag plating technology on Cu for PCB with CS-38.It is an alternative to hot-air solder leveling (HASL) process,and whereby solderable and bonding.The effect of the composition and process conditions on the plating bath and plating Ag layer were discussed.The best composition of plating bath and process condition were concluded.The results show that CS-38 had good stability,the plated Ag layer had good tarnish inhibitor,and it was very suitable for industrial process. |
| |
| Keywords: | electroless plating Ag PCB |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
|
