| 电子组装中焊接设备的选择(待续) |
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| 引用本文： | 史建卫,韩忠军,陈万华,李志文.电子组装中焊接设备的选择(待续)[J].电子工艺技术,2009,30(1). |
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| 作者姓名： | 史建卫 韩忠军 陈万华 李志文 |
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| 作者单位： | 日东电子科技(深圳)有限公司,广东,深圳,518103 |
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| 摘 要： | 再流焊设备与波峰焊设备是自动化电子组装工艺中的主要焊接设备,无铅化工艺对焊接设备提出了许多新的技术要求,相应的对焊接设备的选择也有了新的标准,从无铅化焊接工艺角度出发,分析了两种焊接设备选择中应考虑的问题.
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| 关 键 词： | 电子组装 再流焊 波峰焊 表面组装技术 通孔插装技术 |
Choice of Soldering Equipment in Electronic Assembly |
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| SHI Jian-wei,Han Zhong-jun,CHEN Wan-hua,LI Zhi-wen.Choice of Soldering Equipment in Electronic Assembly[J].Electronics Process Technology,2009,30(1). |
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| Authors: | SHI Jian-wei Han Zhong-jun CHEN Wan-hua LI Zhi-wen |
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| Affiliation: | Sun East Electronic Technology Company Ltd;Shenzhen 518103;China |
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| Abstract: | The reflow soldering machine and wave soldering machine are main equipments in automatic electronic assembly process and lead-free soldering technology brings many new requires,correspondingly the choice of soldering equipment have some new standards.Analyze the demands for choice of two soldering machines according to lead-free soldering process. |
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| Keywords: | Electronic assembly Reflow soldering Wave soldering SMT THT |
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