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以淀粉为填充剂的碳坯渗硅制备反应烧结碳化硅陶瓷
引用本文:武七德,鄢永高,郭兵健,李美娟,刘小磐.以淀粉为填充剂的碳坯渗硅制备反应烧结碳化硅陶瓷[J].无机材料学报,2004,19(2):302-306.
作者姓名:武七德  鄢永高  郭兵健  李美娟  刘小磐
作者单位:武汉理工大学硅酸盐材料工程教育部重点实验室 武汉 430070
基金项目:国家重点科技计划项目(96-A10-01-07);武汉市重点科技计划项目(20001001003)
摘    要:探索了一条高性能RBSC低成本制造的新途径,本研究以石油焦粉为碳质原料制坯,玉米淀粉为填充剂调整碳坯的密度,纯碳素坯经高温渗硅得到密度为3.12g/cm3,强度为580MPa的反应烧结碳化硅陶瓷.研究结果表明掺加淀粉后素坯中含有更多的微孔,烧结体晶粒平均尺寸为2-4μm,晶粒细化是材料性能比传统RBSC材料高的原因.

关 键 词:反应烧结碳化硅  填充剂  显微结构  材料性能  
文章编号:1000-324X(2004)02-0302-06
收稿时间:2003-2-25
修稿时间:2003-7-15

Preparation of SiC Ceramic by Liquid Silicon Infiltration of Carbonaceous Preform Incorporated with Starch
WU Qi-De,YAN Yong-Gao,QUO Bing-Jian,LI Mei-Juan,LIU Xiao-Pan.Preparation of SiC Ceramic by Liquid Silicon Infiltration of Carbonaceous Preform Incorporated with Starch[J].Journal of Inorganic Materials,2004,19(2):302-306.
Authors:WU Qi-De  YAN Yong-Gao  QUO Bing-Jian  LI Mei-Juan  LIU Xiao-Pan
Affiliation:The Key Laboratory of Silicate Materials Science and Engineering. Ministry of Education Wuhan University of technology; Wuhan 430070; China
Abstract:The purpose of this study is to explore new methods to prepare reaction bonded silicon carbide(RBSC) materials with high performance in a lower cost. Unlike the traditional RBSC process, a pure carbonaceous preform was made of petroleum coke in which cornstarch was incorporated to adjust the preform carbon density and micropore structure as well. The pure carbonaceous preform was then infiltrated with liquid silicon and the sintered materials has a density of 3.12g/cm3 and bending strength of 580MPa. The results of observation on the preform microstructure show that the preform with starch contains more fine pore, which is believe to be vital for complete infiltration. XRD analysis shows that the sintered materials contain β-SiC and free Si and a little free carbon. SEM shows the average granule size in the sintered materials is about 2-4μm and is less than that of the traditional RBSC. We conclude that finer grain is the main cause to the higher strength of the material in comparison with the traditional RBSC.
Keywords:Reaction Bonded Silicon Carbide (RBSC)  filler  microstructure  properties
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