| 用有限元方法分析玻璃载芯片封装中的热力耦合问题 |
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| 引用本文： | 侯芳,李军浩. 用有限元方法分析玻璃载芯片封装中的热力耦合问题[J]. 江西电力职工大学学报, 2009, 0(4): 53-55 |
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| 作者姓名： | 侯芳 李军浩 |
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| 作者单位： | [1]江西电力职业技术学院,江西南昌330032 [2]平高集团有限公司,河南平顶山467001 |
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| 摘 要： | 超薄液晶显示器（LCD）模块在经历了热压键合后，由于驱动芯片和玻璃基板之间的温度差异较大，会引起一定程度上的翘曲，并最终导致连接点界面分层现象的发生，影响器件连接可靠性。用实验的方法对比进行研究比较困难，我们用有限元数值模拟的方法并选择通用软件ANSYS对这一现象进行了分析；并详细分析了键合压力、温度、基板温度和IC／玻璃厚度对翘曲的影响。从分析中得知，导致玻璃翘曲的主要原因是键合温度。
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| 关 键 词： | 液晶显示 玻璃载芯片（COG） 有限元分析 倒装键合 微系统封装 |
Finite Element Analysis of Chip-on-Glass Warp Behavior Due to the Thermal and Mechanical Loading |
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| HOU Fang,LI Jun-hao. Finite Element Analysis of Chip-on-Glass Warp Behavior Due to the Thermal and Mechanical Loading[J]. Journal of Jiangxi Electrical University For Staff, 2009, 0(4): 53-55 |
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| Authors: | HOU Fang LI Jun-hao |
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| Affiliation: | 1. Jiangxi Vocational and Technical College of Electricity, Nanchang 330032,China 2. Pinggao Group Co., Ltd Henan Pingdingshan 467001, China) |
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| Abstract: | The warpage of IC and glass in liquid crystal display （LCD） is primarily attributed to the delamination between the interface of gold bump/non-conductive film （NCF） and NCF/glass. In this paper, the influences of bonding parameters on the LCD cell warpage were studied with finite element analysis （FEA）. The numerical model was established using the commercial software ANSYS. The warpage was occurred in the cooled process, and the effects of bonding force, bonding temperature, substrate temperature and IC/glass thickness on the LCD warpage were investigated. From the simulation results, we found the main reason of warpage was bonding temperature. |
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| Keywords: | Liquid crystal display （LCD） chip on glass （COG） finite element analysis （FEA） flip chip bondin microelectronic packaging |
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