新型热管电子器件散热器的实验研究和数值模拟

随着电力电子技术的不断发展,高热流密度器件热控制问题以及出现的热流分布不均匀的现象,是电子电器设备亟待解决的关键技术。热管作为高效传热元件,已经广泛应用于电子器件的散热技术研究中。本文对新型平板式热管散热器进行了数值模拟和实验研究。根据电子器件的运行工况,建立了散热器性能测试系统,并对平板热管型电子器件散热器进行了在不同工况下的性能实验。结果表明采用平板热管散热器可以有效提高CPU芯片的散热性能,芯片发热量在160W后为其最佳工作状态。同时用数值模拟方法对平板热管散热器底面的导热效果进行了优化设计,通过改变导热系数以及扩大模拟芯片尺寸来达到改善CPU冷却散热器的散热效果的目的,并得到了一些有价值的结论,这对改进管散热器的散热效果有一定的指导意义。

Experimental Study and Numerical Simulation ona novel Heat Pipe radiator for Electronic Element

With the continuous development of power electronics, thermal managements of high - density and asymnetric power distributions have been becoming strategically important. Heat pipes for efficient heat ＇transfer components, has been widely used in electronics cooling technology research. In this paper, a new plate type heat pipe for the numerical simulation and experimental research. According to electronic devices operating conditions, the establishment of a radiator performance test systems, a series of experimental research and numerical simulation of heat sink has been made. Results show that the fiat heat pipe can effectively improve the thermal performance CPU chip, the chip heat generation in the post- 160W for its best working condition.Finally, the thermal analysis of fiat heat pipe base has been optimized. By changing the conductivity and to expand the size of analog chips, it can further improve the cooling effect of heat sink, receive some valuable conclusions. All the above achievements help to promote the study of heat sinks, as well as it can be used to design and optimizing of heat sinks.