Development of packaging technologies for microsystems |
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| Authors: | Jin Yu-feng WANG Zhen-feng WEI Jun |
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| Affiliation: | 1. Singapore Institute of Manufacturing Technology, Singapore 638075;Institute of Microelectronics, Peking University, Beijing 100871 China
2. Singapore Institute of Manufacturing Technology, Singapore 638075 |
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| Abstract: | It is well known that packaging plays a very important role in developing microsystems. Packaging accounts for about 60%～80% of cost and function of a microsystem. Package is required to provide mechanical protection, media separation or coupling, signal conditioning, etc. |
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