| LED封装用导电银胶的制备及性能研究 |
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| 引用本文： | 琚伟,伊希斌,张 晶,王启春,陈义祥,范会利,牟秋红.LED封装用导电银胶的制备及性能研究[J].贵金属,2016,37(3):24-28. |
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| 作者姓名： | 琚伟 伊希斌 张 晶 王启春 陈义祥 范会利 牟秋红 |
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| 作者单位： | 1. 山东省科学院新材料研究所山东省粘结材料重点实验室,济南,250014;2. 中国科学院理化技术研究所,北京,100190 |
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| 基金项目： | 山东省中青年科学家科研奖励基金(BS2011CL036)，山东省自然科学基金(ZR2015YL002)，中国科学院院地合作项目。 |
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| 摘 要： | 通过研究树脂体系、固化剂及片状银粉对导电银胶体系力学性能、导电性能及耐候性能的影响,制备出可常温储存的导电银胶。结果表明,银粉质量含量75%,环氧树脂(EP)与聚酰胺酰亚胺树脂(PAI)质量比为80/20,二氨基二苯甲烷/二氨基二苯醚质量比为60/40,所配制的导电银胶的性能能够达到技术指标。样品经封装企业进行上线测试,能够满足应用要求。
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| 关 键 词： | 金属材料 LED 导电银胶 片状银粉 体积电阻率 剪切强度 |
| 收稿时间： | 2015/12/17 0:00:00 |
Study on the Preparation and Properties of Conductive Adhesive for LED Packaging |
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| JU Wei,YI Xibin,ZHANG Jing,WANG Qichun,CHEN Yixiang,FAN Huili and MU Qiuhong.Study on the Preparation and Properties of Conductive Adhesive for LED Packaging[J].Precious Metals,2016,37(3):24-28. |
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| Authors: | JU Wei YI Xibin ZHANG Jing WANG Qichun CHEN Yixiang FAN Huili and MU Qiuhong |
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| Abstract: | By the studing of the influential factors of the resin system, curing agent and flake silver powder on the mechanical properties, conductivity and weather resistance properties, a conductive adhesive which could be stored at room temperature was prepared finally. The results showed that the conductive adhesive with 75% silver powder, the quality ratio of EP resin to PAI resin being 80/20, the quality ratio of 4, 4-diaminodiphenyl methane to 4,4-oxydianiline being 60/40, could meet the technical indicators. After being tested in a LED packaging factory, the bulk production could meet the application requirements of the enterprise. |
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| Keywords: | metal materials LED conductive adhesive flake silver powder volume resistivity shear strength |
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