| 半导体封装模具的失效形式及预防方法 |
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| 引用本文： | 郭京汉.半导体封装模具的失效形式及预防方法[J].塑料制造,2013(5):44-46. |
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| 作者姓名： | 郭京汉 |
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| 作者单位： | 飞思卡尔半导体中国有限公司,天津300000 |
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| 摘 要： | 以SOIC半导体产品为例分析半导体塑料封装模具的工作原理及其失效形式．讨论了与半导体塑料封装模具失效相关的模具关键零件的选材、加工及预防方面的技术要点。
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| 关 键 词： | 半导体塑封模具 失效 预防方法 |
Expiration Form of the Semiconductor Molding-Die and Preventing Measure |
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| Guo Jinghan.Expiration Form of the Semiconductor Molding-Die and Preventing Measure[J].Plastics Manufacture,2013(5):44-46. |
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| Authors: | Guo Jinghan |
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| Affiliation: | Guo Jinghan (Freescale Semiconductor (China) co. Ltd. Tianjin,300000) |
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| Abstract: | Take the SOIC product as an example to analyze the operational principle and expiration of the Semiconductor Molding--Die. It explores the selection key Molding parts, process and preventing measure relating to the Semiconductor Molding-Die Expiration. |
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| Keywords: | Semiconductor Molding-Die Expiration and Preventing Measure |
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