| 烧结法与熔渗法铜铬触头微观组织差异及对电性能的影响 |
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| 引用本文： | 傅肃嘉.烧结法与熔渗法铜铬触头微观组织差异及对电性能的影响[J].高压电器,2003,39(4):52-55. |
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| 作者姓名： | 傅肃嘉 |
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| 作者单位： | 浙江省冶金研究院,浙江,杭州,310013 |
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| 摘 要： | 评述了熔渗法和混粉烧结法两种工艺制备的CuC触头的微观结构差异及对其电开断性能的影响。与熔渗法相比,烧结法制备的CuCr触头具有更好的抗熔焊性能、更低的截流值和更好的吸放气性能,但因其机械强度较低,耐压性能可能不如熔渗法触头。对两种工艺提出了改进的建议。
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| 关 键 词： | 铜铬触头材料 熔渗法 烧结法 微观结构 影响 |
| 文章编号： | 1001-1609(2003)04-0052-04 |
| 修稿时间： | 2003年3月1日 |
MICROSTRUCTURES AND INTERRUPTING BEHAVIORS OF CuCr CONTACTS MADE BY P/M MANUFACTURE PROCESSES |
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| FU Su-jia.MICROSTRUCTURES AND INTERRUPTING BEHAVIORS OF CuCr CONTACTS MADE BY P/M MANUFACTURE PROCESSES[J].High Voltage Apparatus,2003,39(4):52-55. |
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| Authors: | FU Su-jia |
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| Abstract: | Microstructure characteristics and their effects on interrupting behaviors are discussed for CuCr vacuum contact materials made by P/M sintering and infiltration processes.Compared with that of infiltration process,the contact made by sintering process shows better anti-welding ability,lower chopping current and more excellent gas absorption ability,but its dielectric strength is not as good as that of infiltration CuCr contact due to its relatively low mechanical strength.Suggestions for further improvement of these contacts are also presented. |
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| Keywords: | CuCr contact materials sintering process infiltration process microstructure effects |
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