Flat erosion magnetron sputtering with a moving unbalanced magnet |
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Authors: | Takayuki Iseki |
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Affiliation: | Technology Development Department, JVC, Victor Company of Japan Ltd., Shinmei-cho 58-7, Yokosuka, Kanagawa 239-8550, Japan |
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Abstract: | A flat erosion-sputtering system has been developed using a rotating unbalanced and asymmetrical magnet. Target utilization and uniformity of erosion on the 5-in. target were greatly improved over the usual magnetron sputtering system by using a novel magnetron cathode to generate a wider, rotating magnetic flux. The novel magnetron cathode used the yoke magnet in which the stronger magnet set shifted towards the center and the weaker towards the periphery. This yoke magnet was attached to slant toward the center of rotation and rotated during sputtering. The estimated target utilization went up to 80% when the target was finally used up, and the uniformity of sputtered film was within 5% over an area 80 mm in diameter. |
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Keywords: | Magnetron sputtering Flat erosion Unbalanced magnet Target utilization |
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