Optimization of photochemical machining process parameters for manufacturing microfluidic channel |
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Authors: | Devendra Agrawal Dinesh Kamble |
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Affiliation: | 1. Department of Mechanical Engineering, SCOE Vadgaon (Bk.), SPPU Pune, Pune, India;2. Department of Mechanical Engineering, COE Malegaon(Bk.), SPPU Pune, India;3. Department of MechanicalEngineering, VIIT Kondhwa, SPPU Pune, Pune, India |
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Abstract: | In the present study, the investigation on photochemical machining (PCM) of stainless steel (SS-304) by ferric chloride as etchant is reported. SS-304 is machined by PCM process to obtain accurate dimensions and better geometrical features. Weighted grey relational analysis (WGRA) technique is used in optimization of PCM process parameters. DoE (L27) orthogonal array is applied to evaluate machining parameters, such as concentration of etchant, etching time, and temperature of etchant. The multiobjective optimization technique is used to optimize material removal rate (MRR), surface roughness (Ra), undercut (Uc) and etch factor (EF). Weighted grey relational grade is calculated to minimize Uc and surface roughness and to maximize MRR and EF. The quality characteristics MRR, EF, Uc, and Ra are reporting the improvement after the confirmatory test. The optimum machining parameters are processed to manufacture the microfluidic channel used in biomedical applications. The microfluidic channels and its assembly with Y-type for mixing of fluid with a size of 100 µm, 200 µm, and 300 µm are developed and investigated. |
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Keywords: | PCM etching phototool undercut MRR DoE WGRA microchannel |
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