| BGA封装技术研究 |
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| 引用本文： | 李秀清,葛新霞.BGA封装技术研究[J].微纳电子技术,2000(4). |
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| 作者姓名： | 李秀清 葛新霞 |
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| 作者单位： | 电子十三所!石家庄050051 |
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| 摘 要： | 介绍了 BGA技术的研究现状 ,着重从芯片互连、基板材料及封装设计等方面讨论了该技术的发展前景。
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| 关 键 词： | 封装 芯片互连 BGA |
Study on the Ball Grid Array Packaging |
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| Li Xiuqing,Ge Xinxia.Study on the Ball Grid Array Packaging[J].Micronanoelectronic Technology,2000(4). |
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| Authors: | Li Xiuqing Ge Xinxia |
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| Abstract: | This paper introduces the research status of ball grid array packaging.The special stress is put on chip interconnection,substrate materials and packaging designs.And the future prospect of this technology is also briefly described. |
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| Keywords: | Packaging Chip interconnecting Ball grid array |
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