| 基于电子剪切散斑法的塑封材料的无损检测 |
| |
| 引用本文： | 米红林,何小元. 基于电子剪切散斑法的塑封材料的无损检测[J]. 包装工程, 2011, 32(5): 29-31,48 |
| |
| 作者姓名： | 米红林 何小元 |
| |
| 作者单位： | 上海应用技术学院,上海200235;东南大学,南京,210096;东南大学,南京,210096 |
| |
| 基金项目： | 上海市教育委员会一般项目(060Z028) |
| |
| 摘 要： | 为检测轻工业产品的密封性能,应用电子错位散斑法对密封盖、药用密封装置以及食品塑封进行了检测。结果表明:电子错位散斑法能够较好地识别不同密封装置,不同部位,大小、形状各不相同的缺陷,迅速准确地对塑料密封结构质量做出判断;该方法操作简便,对缺陷部位敏感,能够较好地应用于实际现场测试。
|
| 关 键 词： | 无损检测 电子剪切散斑法 塑封材料 |
| 收稿时间： | 2010-10-10 |
| 修稿时间： | 2011-03-10 |
Nondestructive Examination of Plastic Sealing Materials by ESSPI |
| |
| MI Hong-lin and HE Xiao-yuan. Nondestructive Examination of Plastic Sealing Materials by ESSPI[J]. Packaging Engineering, 2011, 32(5): 29-31,48 |
| |
| Authors: | MI Hong-lin and HE Xiao-yuan |
| |
| Affiliation: | MI Hong-lin1,2,HE Xiao-yuan2(1.Shanghai Institute of Technology,Shanghai 200235,China,2.Southeast University,Nanjing 210096,China) |
| |
| Abstract: | In order to test the sealed performance of plastic product for light industry,sealed cap,medical sealed device and sealed part for food plastic bag were tested by ESSPI technique respectively.The results showed that deflects of different sealed devices,different parts,dimensions,and shape can be identified by ESSPI method.Simultaneously,this technique is convenience for operation and is very sensitive to the deflective parts.ESSPI method can be used in nondestructive test on spot. |
| |
| Keywords: | nondestructive test electronic shear speckle pattern interferometry(ESSPI) sealing plastic material |
| 本文献已被 CNKI 万方数据 等数据库收录！ |
| 点击此处可从《包装工程》浏览原始摘要信息 |
|
点击此处可从《包装工程》下载全文 |
|
