| 塑封IC常见失效及对策 |
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| 引用本文： | 李双龙.塑封IC常见失效及对策[J].电子与封装,2004,4(2):31-33,40. |
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| 作者姓名： | 李双龙 |
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| 作者单位： | 天水华天微电子有限公司,甘肃,天水,741000 |
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| 摘 要： | 本文探讨了塑封IC常见失效分析步骤、失效分析手段以及提高可靠性采取的措施：
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| 关 键 词： | 失效 失效分析 可靠性 |
Plastic packaging IC common failure and prevent action |
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| Li Shuanglong Tianshui Huatian Micro-Electronics Co.,Ltd,Tianshui,Gansu.Plastic packaging IC common failure and prevent action[J].Electronics & Packaging,2004,4(2):31-33,40. |
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| Authors: | Li Shuanglong Tianshui Huatian Micro-Electronics Co Ltd Tianshui Gansu |
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| Affiliation: | Li Shuanglong Tianshui Huatian Micro-Electronics Co.,Ltd,Tianshui,Gansu,741000 |
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| Abstract: | Ths article studies plastic packaging IC common failure and failure analysis procedure. failureanalysis method and the prevent actions to improve the reliability. |
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| Keywords: | Failure Failure analysis Reliability |
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