| 半导体硅片键合:MEMS制造工序中的成熟技术 |
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| 引用本文： | V. Dragoi P. Lindner H. Kirehberger P. Kettner. 半导体硅片键合:MEMS制造工序中的成熟技术[J]. 电子工业专用设备, 2007, 36(1): 31-36 |
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| 作者姓名： | V. Dragoi P. Lindner H. Kirehberger P. Kettner |
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| 作者单位： | EV Group, DI Erich Thallner Strasse 1, A-4782 St. Florian / Inn, Austria |
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| 摘 要： | 新型MEMS应用领域的发展为现有的制造技术带来了很大的挑战,并促使了满足新加工要求的制造能力的发展。根据目前MEMS制造中普遍采用的不同的晶圆键合方法及其主要工艺参数要求,开发了一种新型的晶圆键合技术。
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| 关 键 词： | 硅片键合 微机电系统 制造工艺 |
| 文章编号： | 1004-4507(2007)01-0031-06 |
| 修稿时间： | 2006-01-03 |
Wafer Bonding:a Mature Technology for MEMS Manufacturing |
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| V.Dragoi,P.Lindner,H.Kirchberger,P.Kettner. Wafer Bonding:a Mature Technology for MEMS Manufacturing[J]. Equipment for Electronic Products Marufacturing, 2007, 36(1): 31-36 |
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| Authors: | V.Dragoi P.Lindner H.Kirchberger P.Kettner |
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| Affiliation: | EV Group,DI Erich Thallner Strasse 1,A-4782 St.Florian/Inn,Austria |
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| Abstract: | The new MEMS applications raised important challenges to the existing manufacturing technologies and lead to the development of new processes able to fulfill the new demands. Based on the different wafer bonding approaches that are currently used in MEMS manufacturing, and their main parameters of the wafer bonding processes used nowadays in MEMS manufacturing, a new type of wafer bonding technique was developed in order to accommodate these specific requirements. |
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| Keywords: | Wafer bonding MEMS fabrication Wafer bonding process |
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