表面微结构金属干式电极制造及细菌粘附性能研究

为开发出高性能生物医用干式电极，提出了利用激光微铣-重铸加工方法，实现了表面具有微结构阵列特征的新型金属干式电极的制造成形。在分析电极表面微观形貌的基础上，研究了电极表面的润湿性能，并重点研究了扫描间距、扫描速度和扫描次数等加工参数对大肠杆菌粘附性能的影响规律。研究结果表明：在一定工艺参数条件下所加工出具有微结构阵列特征的电极的接触角可达150°以上，表现出超疏水的特性。在不同扫描间隙和扫描次数条件下加工出的电极对大肠杆菌的粘附性能具有较大影响，在选择0.1 mm扫描间隙时，电极表面粘附的大肠杆菌数量最少，适当增加扫描次数，也能够有效地减少电极表面大肠杆菌的粘结，从而发挥较好的抗菌效果。通过改变扫描速度加工出的电极则对大肠杆菌的粘附性能影响不大。

Fabrication and bacterial adhesion of metal dry electrode with surface microstructure arrays

To develop a high performance biomedical dry electrode, the laser micromilling-recasting technology is used to fabricate the metal dry electrode with surface micostructure arrays. Based on the analysis of the micro morphology of the electrode surface, the wettability of the electrode surface is discussed, and then the influence of laser processing parameters such as scanning spacing, scanning speed and scan times on the adhesion performance of Escherichia coli is further investigated. The results show that the contact angle of metal dry electrode with surface microstructure arrays fabricated with reasonable laser processing parameter can reach more than 150° and show the superhydrophobic characteristics. The adhesion performance of escherichia coli of electrode is changed greatly with different scanning spacing and scan times. When the 0.1 mm scanning spacing is selected, the least amount of escherichia coli is found on the surface of electrode. With the increasing scan times, the adhesion amount of escherichia coli can be reduced. However, the scanned speed has little effect on the adhesion performance of escherichia coli for metal dry electrode.