Analysis of charges and surface states at the interfaces of semiconductor-insulator-semiconductor structures

A method for determining the energy spectrum of charges and surface-state densities at the interfaces of semiconductor-insulator-semiconductor structures was developed; the method is based on the analysis of capacitance-voltage characteristics. The method was experimentally tested with Si-SiO₂-Si structures prepared by direct bonding of both mirror-polished smooth wafers and wafers with a regular mesoscopic relief pattern at the inner surface of the wafers to be bonded. The density of surface states is lower at the surfaces with a regular relief pattern than that at the surfaces without the surface relief.