| 电子元器件热电冷却技术研究进展 |
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| 引用本文： | 朱冬生,雷俊禧,王长宏,胡韩莹. 电子元器件热电冷却技术研究进展[J]. 微电子学, 2009, 39(1) |
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| 作者姓名： | 朱冬生 雷俊禧 王长宏 胡韩莹 |
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| 作者单位： | 华南理工大学化学与化工学院传热强化与过程节能教育部重点实验室,广州,510640 |
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| 基金项目： | 国家高技术研究发展计划(863计划) |
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| 摘 要： | 在深刻分析热电制冷机理的基础上,结合国内外学者对热电制冷技术用于电子元器件热管理的理论分析,从芯片整体表面散热和局部热点消除两方面,详细介绍了集成电路芯片热电冷却实验的国内外研究进展;对芯片热电冷却技术的数值模拟与热电制冷器(TEC)的选型优化进行了详细报道;指出国内缺乏芯片热电冷却的应用研究,在芯片散热的整体研究水平上与国外仍有差距.芯片热电冷却及其表面的热管理将是今后提高电子元器件散热性能的一个重要研究方向.
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| 关 键 词： | 电子元器件 集成电路 热电制冷 热电冷却 热管理 |
Research Progress in Electronic Component Heat Dissipation Using Thermoelectric Cooling Technology |
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| ZHU Dongsheng,LEI Junxi,WANG Changhong,HU Hanying. Research Progress in Electronic Component Heat Dissipation Using Thermoelectric Cooling Technology[J]. Microelectronics, 2009, 39(1) |
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| Authors: | ZHU Dongsheng LEI Junxi WANG Changhong HU Hanying |
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| Affiliation: | Key Lab of Enhanced Heat Transfer and Energy Conservation of Ministry of Education;School of Chemistry andChemical Engineering;South China University of Technology;Guangzhou 510640;P.R.China |
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| Abstract: | Based on the analysis of the principle of thermoelectric refrigeration and theory of thermoelectric cooling(TEC) for electronic component thermal management,progress in research and experiments of IC chip thermoelectric cooling was described in detail,including heat dissipation of the whole exterior and "hot spot" removal.Numerical simulation and type-selection optimization of TEC were also reported.It is pointed out that application research of IC chip thermoelectric cooling in China is quite limited,and s... |
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| Keywords: | Electronic component Integrated circuit Thermoelectric refrigeration Thermoelectric cooling Thermal management |
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