| 埋电阻台阶式多层微波印制板制造技术研究 |
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| 引用本文： | 杨维生.埋电阻台阶式多层微波印制板制造技术研究[J].电子工艺技术,2007,28(2):84-86,89. |
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| 作者姓名： | 杨维生 |
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| 作者单位： | 南京电子技术研究所,江苏,南京,210013 |
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| 摘 要： | 目前来说,通讯用陶瓷粉填充、玻璃短纤维增强的聚四氟乙烯微波多层印制电路板的制造技术越来越显现出其重要性,对平面电阻印制板的制造工艺流程进行了简单的介绍,对埋电阻台阶式多层微波印制板制造所采用的工艺技术进行了较为详细的论述.
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| 关 键 词： | 平面埋电阻 印制板 工艺 |
| 文章编号： | 1001-3474（2007）02-0084-04 |
| 修稿时间： | 2007-01-29 |
Study on the Processing Technology of the Step Designed Planar Buried Resistant Microwave Multilayer Printed Circuit Board |
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| YANG Wei-sheng.Study on the Processing Technology of the Step Designed Planar Buried Resistant Microwave Multilayer Printed Circuit Board[J].Electronics Process Technology,2007,28(2):84-86,89. |
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| Authors: | YANG Wei-sheng |
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| Affiliation: | Nanjing Research Institute of Electronic Technology, Nanjing 210013, China |
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| Abstract: | Recently, the fabrication technology of the microwave muhilayer printed circuit board of the glass mierofiber reinforced polytetrafluoetylene with ceramic particles filled composite applied for communication was very important. The fabrication of the planar buried resistant printed circuit board was briefly introduced. The possibility and utility of the processing technology of the step designed planar buried resistant microwave muhilayer printed circuit board were also illuminated. |
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| Keywords: | Planar buried resistant Printed circuit board Processing technology |
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