Preparation technique for copper-plating on Si nanoporous pillar array |
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Authors: | Xiao Hui Yang Wei Fen Jiang |
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Affiliation: | a Department of Mathematics and Information Science, North China University of Water Resources and Electric Power, Zhengzhou 450011, PR Chinab Department of Physics and Laboratory of Material Physics, Zhengzhou University, Zhengzhou 450052, PR China |
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Abstract: | Silicon nanoporous pillar array (Si-NPA) is prepared by hydrothermally etching method. The copper/silicon nanocomposite thin film (Cu/Si-NPA) is obtained utilizing a reductive deposition method where Si-NPA acts both as a reducing agent and as a substrate. Microstructural analysis indicates that Si-NPA is composed of large quantities of well-separated, quasi-identical silicon pillars which are uniform and perpendicular to the surface. The pillar surface is nanoporous and the pore wall is composed of silicon nanocrystallites with a size about 4 nm. Cu/Si-NPA inherits the morphological characteristic of Si-NPA. The density of the Cu nanoparticles changes alternatively with the geometrical sites of Si-NPA, which leads to the formation of crater-like structures. These results indicate that Si-NPA might be used as an ideal template for synthesizing metal/silicon nanocomposite systems. |
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Keywords: | Silicon nanoporous pillar arrays (Si-NPA) Cu/Si-NPA Hydrothermal etching Immersion plating Crater-like structures |
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