Effect of pressure on the evolution of copper microstructure upon large plastic deformation |
| |
Authors: | T. I. Chashchukhina M. V. Degtyarev L. M. Voronova |
| |
Affiliation: | (1) Department of Chemical Engineering and Materials Science, University of California, Davis, CA 95616, USA |
| |
Abstract: | Copper of 99.99% purity has been deformed by shear under pressure of 2, 6, or 9 GPa at room temperature. The structural changes observed correspond to the temperature and strain-rate conditions of deformation and occur as a result of three processes, namely, dynamic recovery, dynamic recrystallization, and post-dynamic recrystallization, relationship between which depends on the pressure applied. At a pressure of 2 GPa, the dynamic recovery plays a significant role, showing up in the absence of deformation-induced hardening and in a low driving force for grain growth upon the post-dynamic recrystallization. As the pressure rises to 6 GPa, the recovery is hampered and the post-dynamic recrystallization leads to growth of some coarse grains. Grains of more uniform size are retained after deformation at a pressure of 9 GPa. |
| |
Keywords: | |
本文献已被 SpringerLink 等数据库收录! |
|