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Investigation of the radiation hardness on semiconductor devices using the ion micro-beam |
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| Authors: | T Nishijima T Ohshima K K Lee |
| Affiliation: | a National Institute of Advanced Industrial Science and Technology (AIST), Photonics Research Institute, Tsukuba Central 2, Tsukuba, Ibaraki 305-8568, Japan b Japan Atomic Energy Research Institute, Takasaki, Gunma 370-1292, Japan |
| Abstract: | Variation of the ion beam induced charge (IBIC) pulse heights due to ion irradiation was investigated on a Si pn diode and a 6H-SiC Schottky diode using a 2 Mev He+ micro-beam. Each diode was irradiated with a focused 2 MeV He+ micro-beam to a fluence in the range of 1×109–1×1013 ions/cm2. Charge pulse heights were analyzed as a function of the irradiation fluence. After a 2 MeV ion irradiation to the Si pn junction diode, the IBIC pulse height decreased by 15% at 9.2×1012 ions/cm2. For the SiC Schottky diode, with a fluence of 6.5×1012 ions/cm2, the IBIC pulse height decreased by 49%. Our results show that the IBIC method is applicable to evaluate irradiation damage of Si and SiC devices and has revealed differences in the radiation hardness of devices dependent on both structural and material. |
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