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FGH91粉末高温合金与K418B铸造叶环热等静压扩散连接研究
引用本文:罗学军,王珏,赵巍,马国君,武丹,王旭青. FGH91粉末高温合金与K418B铸造叶环热等静压扩散连接研究[J]. 粉末冶金技术, 2021, 39(4): 291-296. DOI: 10.19591/j.cnki.cn11-1974/tf.2021010002
作者姓名:罗学军  王珏  赵巍  马国君  武丹  王旭青
作者单位:1.中国航发北京航空材料研究院先进高温结构材料重点实验室,北京 100095
摘    要:采用热等静压工艺进行了FGH91粉末高温合金和K418B铸造叶环扩散连接试验,研究了FGH91-K418B双合金的界面成分扩散和连接接头的组织和力学性能。结果表明,在连接界面足够清洁的条件下,选择1190 ℃+170 MPa的热等静压工艺,可以实现FGH91和K418B两种合金良好的冶金连接。进一步观察和分析发现,扩散连接接头致密完整,无夹杂物和连续的第二相析出物,扩散区宽度80~120 μm。FGH91-K418B双合金的拉伸性能、持久性能和显微组织具有良好的一致性,试样断裂均未发生在界面结合处。

关 键 词:粉末高温合金   铸造叶环   整体叶盘   热等静压   扩散连接
收稿时间:2021-01-08

Research on diffusion bonding of FGH91 powder metallurgy superalloy and K418B castedblade by hot isostatic pressing
Affiliation:1.Science and Technology on Advanced High Temperature Structural Materials Laboratory, AECC Beijing Institute of Aeronautical Materials, Beijing 100095, China2.Sixth Representative Office of the Air Force Armament Department in Beijing, Beijing 101300, China
Abstract:The diffusion bonding test of FGH91 powder metallurgy (PM) superalloy and K418B castedblade was carried out by hot isostatic pressing (HIP). The elemental diffusion at the interface of FGH91-K418B dual alloys and the microstructure and mechanical properties of the joint were investigated. The results show that, under the condition that the bonding interface is clean enough and the HIP process is 1190 ℃+170 MPa, the good metallurgical bonding of FGH91 and K418B can be achieved. In addition, the diffusion bonding joint is compact and complete, and no inclusions and continuous second-phase precipitates are found. The width of the diffusion zone is in the range of 80~120 μm. The FGH91-K418B dual alloys have the good consistency of tensile properties, stress rupture properties, and microstructure, and the fracture does not occur at the interface joint.
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