等离子体抛光对表面粗糙度的影响

为了得到超光滑表面且无表层损伤的光学元件,引入一种新型的超光滑表面加工技术——等离子体抛光.在新设计的等离子加工实验平台上进行了等离子体加工工艺实验,对氧气流量,放电功率大小,磁场大小几个参数对基片表面粗糙度的影响进行了实验研究,且优化了工艺参数.结果表明增加氧气流量,合理控制功率和磁场强度都会使等离子体抛光基片表面粗糙度减小.当氧气流量为50 sccm,功率为80 W,磁场强度为17 mT时,粗糙度达到最小值0.9 nm.

Research on Variation of Surface Roughness by Plasma Polishing Process

Plasma polishing,a novel super smooth surface fabrication technology,is introduced to obtain super smooth optical element without surface or sub-surface damage.Experiments on variation of surface roughness influenced by the O2 flow rate,the power of RF and magnet field intensity have been implemented on established plasma machining platform.The technological parameters have been optimized.The results show that the roughness of the fused silicon substrate changed with the variation of the O2 flow rate,the po...