脉冲伏安法测定酸性镀铜液中氯离子

本文以三电极体系为基础,采用脉冲伏安法测定酸性镀铜液中Cl-的含量,考察了富集电位,富集时间,电解液中CuSO4·5H2O浓度、H2SO4浓度和Cl-浓度对溶出峰电流密度的影响。实验结果表明,在酸性光亮镀铜液中,富集电位为0.30 V、富集时间为30 s时,Cl-的脉冲伏安法曲线峰形好,峰电流密度高,检测灵敏度高,Cl-检测限线性范围为0.1~20 mg/L,线性方程的方差为R2=0.9965,检测限为0.047 mg/L。本文所采用的脉冲伏安法测定酸性光亮镀铜液中Cl-含量灵敏度高、稳定性好并且抗干扰性强。利用此方法在实际生产过程中无需样品前处理即可对Cl-含量进行即时测定。

Determination of Chloride Ion in Acidic Copper Plating Bath by Pulse Voltammetry

The work aims to provide a no-pretreatment method for fast and accurate determination of chloride in copper plating baths.Based on the three-electrode system,the content of Cl^-in acid copper plating solution was determined by the pulse voltammetry.The effects of enrichment potential,enrichment time,copper sulfate concentration,sulfuric acid concentration and chloride ion concentration on the pulse voltammetry curve were investigated.The experimental results indicated that the peak of Cl^-in the pulse voltammetry curve exhibited a good shape when the enrichment potential was 0.30 V and the enrichment time was 30 s.Moreover,the current intensity showed a good correlation to the concentration of Cl^-in the range of 0.1-20 mg/L and the variance of the linear equation is R^2=0.9965,with a detection limit of 0.047 mg/L.The pulse voltammetry method developed in this research for detecting Cl-content in acid bright copper plating solution possesses a high sensitivity,good stability and strong anti-interference.With this method,the Cl^-content can be measured immediately in the actual production process.