| Sn-Ag-Cu系无铅焊料性能研究进展 |
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| 引用本文： | 张莎莎,张亦杰,马乃恒,王浩伟. Sn-Ag-Cu系无铅焊料性能研究进展[J]. 热加工工艺, 2010, 39(1) |
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| 作者姓名： | 张莎莎 张亦杰 马乃恒 王浩伟 |
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| 作者单位： | 上海交通大学金属基复合材料国家重点实验室,上海,200240 |
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| 摘 要： | Sn-Ag-Cu是全球公认的最具潜力替代Sn-Pb钎料的无铅焊料。本文介绍了Sn-Ag-Cu系无铅焊料在熔化温度、润湿性、抗氧化性和焊接可靠性方面的主要性能以及最近的研究重点,最后对Sn-Ag-Cu系无铅焊料的发展趋势进行了展望。
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| 关 键 词： | 无铅焊料:Sn-Ag-Cu 性能 |
Investigation Progress on Properties of Sn-Ag-Cu Lead Free Solder Paste |
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| ZHANG Shasha,ZHANG Yijie,MA Naiheng,WANG Haowei. Investigation Progress on Properties of Sn-Ag-Cu Lead Free Solder Paste[J]. Hot Working Technology, 2010, 39(1) |
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| Authors: | ZHANG Shasha ZHANG Yijie MA Naiheng WANG Haowei |
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| Affiliation: | ZHANG Shasha,ZHANG Yijie,MA Naiheng,WANG Haowei(State Key Laboratory of MMCs,Shanghai Jiao Tong University,Shanghai 200240,China) |
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| Abstract: | Sn-Ag-Cu solder systems are one of the most promising lead-free alloys.The studying emphasis,such as melting temperature,wettability,oxidation resistance as well as soldering reliability are summarized in details.Furthermore,the prospects for development of Sn-Ag-Cu solder systems are proposed. |
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| Keywords: | lead-free solder Sn-Ag-Cu properties |
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