| SiC/Cu-Al复合材料无压浸渍制备工艺的研究 |
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| 引用本文： | 杜双明,胡丞,王明静,赵维涛. SiC/Cu-Al复合材料无压浸渍制备工艺的研究[J]. 电子元件与材料, 2011, 30(5): 38-41 |
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| 作者姓名： | 杜双明 胡丞 王明静 赵维涛 |
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| 作者单位： | 西安科技大学材料科学与工程学院; |
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| 基金项目： | 西安科技大学科研创新基金项目资助(No.200637) |
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| 摘 要： | 利用化学镀法在SiC颗粒表面包覆Cu层制备了SiC/Cu复合粉体,然后将其压制成预制体并在熔融铝液中无压浸渍,制出了SiC/Cu-Al复合材料.研究了浸渍温度和时间对所制SiC/Cu-Al复合材料浸渍效果的影响.结果表明:SiC颗粒表面的Cu包覆层分布均匀;在800℃、保温2h条件下制备的SiC/Cu-Al复合材料显微...
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| 关 键 词： | 化学镀铜 SiC/Cu复合粉体 无压浸渍 SiC/Cu-Al复合材料 |
Study on preparation technique of SiC/Cu-Al composite by pressureless infiltration |
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| DU Shuangming,HU Cheng,WANG Mingjing,ZHAO Weitao. Study on preparation technique of SiC/Cu-Al composite by pressureless infiltration[J]. Electronic Components & Materials, 2011, 30(5): 38-41 |
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| Authors: | DU Shuangming HU Cheng WANG Mingjing ZHAO Weitao |
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| Affiliation: | DU Shuangming,HU Cheng,WANG Mingjing,ZHAO Weitao(College of Material Science and Engineering,Xi'an University of Science and Technology,Xi'an 710054,China) |
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| Abstract: | SiC/Cu composite powders were prepared by coating SiC particles with Cu using the chemical plating method.SiC/Cu-Al composite was then prepared by soaking the preform made from SiC/Cu composite powders in molten aluminum under argon gas and 1 atm.The effects of soaking temperature and time on the infiltration depth of Al and microstructure of SiC/Cu-Al composite were studied.The results show that: For SiC/Cu composite powders,Cu particles uniformly distribute on the surface of SiC particles;The SiC/Cu-Al co... |
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| Keywords: | chemical copper plating SiC/Cu composite powder pressureless infiltration SiC/Cu-Al composite |
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